10 research outputs found
Prototype ATLAS IBL Modules using the FE-I4A Front-End Readout Chip
The ATLAS Collaboration will upgrade its semiconductor pixel tracking
detector with a new Insertable B-layer (IBL) between the existing pixel
detector and the vacuum pipe of the Large Hadron Collider. The extreme
operating conditions at this location have necessitated the development of new
radiation hard pixel sensor technologies and a new front-end readout chip,
called the FE-I4. Planar pixel sensors and 3D pixel sensors have been
investigated to equip this new pixel layer, and prototype modules using the
FE-I4A have been fabricated and characterized using 120 GeV pions at the CERN
SPS and 4 GeV positrons at DESY, before and after module irradiation. Beam test
results are presented, including charge collection efficiency, tracking
efficiency and charge sharing.Comment: 45 pages, 30 figures, submitted to JINS
Production and integration of the ATLAS Insertable B-Layer
During the shutdown of the CERN Large Hadron Collider in 2013-2014, an
additional pixel layer was installed between the existing Pixel detector of the
ATLAS experiment and a new, smaller radius beam pipe. The motivation for this
new pixel layer, the Insertable B-Layer (IBL), was to maintain or improve the
robustness and performance of the ATLAS tracking system, given the higher
instantaneous and integrated luminosities realised following the shutdown.
Because of the extreme radiation and collision rate environment, several new
radiation-tolerant sensor and electronic technologies were utilised for this
layer. This paper reports on the IBL construction and integration prior to its
operation in the ATLAS detector.Comment: 90 pages in total. Author list: ATLAS IBL Collaboration, starting
page 2. 69 figures, 20 tables. Published in Journal of Instrumentation. All
figures available at:
https://atlas.web.cern.ch/Atlas/GROUPS/PHYSICS/PLOTS/PIX-2018-00